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TSMC leads in advanced chip packaging rankings

2023/08/03

Chinese chipmaker Taiwan Semiconductor Manufacturing Co. (TSMC) has developed the most patents surrounding advanced chip packaging, followed by Samsung Electronics and then Intel, according to data from LexisNexis. TSMC has 2,946 advanced packaging patents and also has the highest quality. Samsung Electronics, which ranks second in terms of quantity and quality of the patents, has 2,404. Ranked third, Intel has 1,434 patents in its advanced packaging portfolio. Intel, Samsung and TSMC have been steadily investing in advanced packaging technology since around 2015, when all three began to add to their patent portfolios, according to the data. 




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